Document reference

2018/2947(DEA)  
Exemption for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages  
Basic information  

2018/2947(DEA)

DEA - Delegated acts procedure

Supplementing 2008/0240(COD)

Subject
3.40.06 Electronics, electrotechnical industries, ICT, robotics
3.70.13 Dangerous substances, toxic and radioactive wastes (storage, transport)

Status

Awaiting Council decision on delegated act

 

Key players  
  • Committee responsible
    Rapporteur
    Appointed
    ENVI  
    Environment, Public Health and Food Safety
Key events  
16/11/2018
Non-legislative basic document published
16/11/2018
Initial period for examining delegated act 2 month(s)
28/11/2018
Committee referral announced in Parliament, 1st reading/single reading
24/01/2019
Delegated act not objected by Parliament
Technical information  
Procedure reference
2018/2947(DEA)
Procedure type
DEA - Delegated acts procedure
Procedure subtype
Examination of delegated act
Stage reached in procedure
Awaiting Council decision on delegated act
Committee dossier
ENVI/8/15029
Documentation gateway  
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